NCKU Curriculum Map
1. 2.
3.
SOLID MECHANICS IN ELECTRONIC PACKAGE

Course Goal
A. Cultivate professional research experts.
Course Principle Literacy and Competence
[Competence]
  • Professional knowledge in engineering field.
  • Plan and execute case study.
  • Creative thinking and independent problem-solving ability.
  • Courses of Recent Years
    Year/
    Semester
    Course
    Number
    Class
    Code
    Course Name
    (The name will link to the syllabus.)
    Credit Taught in English
    (Yes or No)
    Instructor
    0108/1 N963600 [ES7812]SOLID MECHANICS IN ELECTRONIC PACKAGE 3.0 N Pan, Wen-Fung
    0107/1 N963600 [ES7812]SOLID MECHANICS IN ELECTRONIC PACKAGE 3.0 N Pan, Wen-Fung
    0106/1 N963600 [ES7812]SOLID MECHANICS IN ELECTRONIC PACKAGE 3.0 N Pan, Wen-Fung
    0105/2 N963600 [ES7812]SOLID MECHANICS IN ELECTRONIC PACKAGE 3.0 N Pan, Wen-Fung
    0104/2 N963600 [ES7812]SOLID MECHANICS IN ELECTRONIC PACKAGE 3.0 N Pan, Wen-Fung
    0103/1 N963600 [ES7812]SOLID MECHANICS IN ELECTRONIC PACKAGE 3.0 N Chen, Rong-Sheng
    0102/1 N963600 [ES7812]SOLID MECHANICS IN ELECTRONIC PACKAGE 3.0 N Chen, Rong-Sheng
    0101/1 N963600 [ES7812]SOLID MECHANICS IN ELECTRONIC PACKAGE 3.0 N Chen, Rong-Sheng
    0100/1 N963600 [ES7812]SOLID MECHANICS IN ELECTRONIC PACKAGE 3.0 N Chen, Rong-Sheng
    0099/1 N963600 [ES7812]SOLID MECHANICS IN ELECTRONIC PACKAGE 3.0 N Lee, Chau-Fei
    0098/1 N963600 [ES7812]SOLID MECHANICS IN ELECTRONIC PACKAGE 3.0 N Lee, Chau-Fei

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